AI Stack
China's AI stack spans the whole vertical: AI chips, open-weight and proprietary foundation models, reasoning and multimodal systems, and model-serving platforms.
General-purpose GPU chips; first GPU maker to list in Hong Kong.
AI training/inference accelerator cards (MLU series) plus NeuWare software.
Horizon Robotics develops automotive-grade AI processors (Journey series) and smart-driving solutions for passenger vehicles. The Journey 6 chip, built on Horizon's proprietary Nash BPU architecture, supports ADAS through urban NOA. Horizon SuperDrive (HSD) is a full-scenario, end-to-end urban driving-assistance solution using transformer-based architecture. Horizon Mono offers front-camera L2 ADAS. The company holds ~45.8% ADAS market share among Chinese OEMs and has shipped over 10 million Journey units. Partners include BYD, Li Auto, Volkswagen, Bosch, and DENSO.
Ascend 910-series AI accelerators with the CANN software stack.
LoongArch-architecture CPUs for PCs, servers and embedded.
GPGPU chips for AI compute; +693% on STAR Market debut.
Full-function GPU on CUDA-compatible MUSA architecture.
XuanTie is a RISC-V processor IP series developed by T-Head Semiconductor, a subsidiary of Alibaba Group. It offers open-source and commercial processor cores (e.g., C906, C910, C920) targeting embedded, IoT, edge AI, and high-performance computing applications. XuanTie competes with ARM and MIPS in processor IP licensing by providing RISC-V-based alternatives. Select cores and related toolchains have been open-sourced.
Integrated DRAM manufacturer focused on DDR5/DDR5 modules, LPDDR5/5X, DDR4 modules and LPDDR4X. HBM is still an emerging roadmap area rather than a broadly available product line.
Fabless memory and MCU vendor with SPI NOR Flash, SPI NAND Flash, parallel NAND Flash, automotive flash, EEPROM, MCUs, sensors and analog products.
Memory and storage products through Longsys and the Lexar brand, including SD/microSD/CFexpress cards, portable SSDs, NVMe/SATA SSDs and DDR5/DDR4 memory modules.
Memory-interface and interconnect chips for cloud and AI infrastructure, including DDR5 RCD/MRCD/MDB, DDR5 PMIC/SPD/temperature sensors, PCIe retimers and CXL memory-expander controllers.
3D NAND flash and storage solutions, including enterprise SSDs, client SSDs, UFS/eMMC embedded memory and PCIe/SATA consumer SSDs under the ZHITAI brand.
Open-weight foundation and reasoning models (V3 / R1 series).
Alibaba's open-weight model family (text, multimodal, coding).
Long-context models and chat assistant from Moonshot AI.
Zhipu's GLM model family; open-weight and API.
Foundation and multimodal models; open-weight and API.
Baidu's ERNIE model family; open-weight (4.5) and API.
Tencent's Hunyuan models (text, image, 3D); some open weights.
ByteDance's model family and consumer assistant; API via Volcano Engine.
Zhipu's open API platform for the GLM models.
Alibaba Cloud's model-serving platform (Bailian) for Qwen and other models.
Open model hub and library (Alibaba): models, datasets, demos.
Baidu's model-development and serving platform (ERNIE + third-party models).
Open-weight code-generation model and IDE assistant (Zhipu).
Alibaba Cloud's AI agent suite for software development and daily work, including IDE coding, CLI, QoderWork desktop and cloud agents.
ByteDance's AI-native IDE with agentic coding workflows.
No-code platform for building AI agents and bots (ByteDance).
Open-source LLM app and agent development platform (LLMOps).
General autonomous agent that plans and executes multi-step tasks in a sandbox.
Full-scenario AI office workspace from Tencent Cloud that plans and executes tasks across documents, spreadsheets, code, design, local files and multi-agent workflows.